GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

Test-flow partitioning between wafer sort and final package test can have a dramatic impact on the cost of test. In some cases, the migration of package tests can be done over time, but the test ...

The emergence of 3-D ICs presents test challenges that extend from design-for-test tools from design-automation companies to device handlers from equipment firms including Advantest and Multitest. A ...

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...