Today’s highly complex and large system on chip (SoC) devices and systems present many challenges to be addressed from manufacturing tests to the field while meeting stringent requirements for test ...

New liquid-cooling enabled system delivers affordable, high-density SLT and burn-in test for high-demand, lower-volume HPC, AI, and automotive devices TOKYO, Sept. 18, 2025 (GLOBE NEWSWIRE) -- Leading ...

The AI and HPC industries are rapidly shifting toward chiplet-based designs to achieve unprecedented levels of performance, as traditional monolithic system-on-chip (SoC) architectures face scaling ...