A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. “Wafer-level ...

As designs move beyond System-on-Chip (SoC) to more complex System-of-Systems (SoS), it’s essential for design teams to effectively verify that these systems function together as intended.

Today and more tomorrow, Electronic system design requires to be concerned with the power consumption consideration. Currently, in a lot of design tools, the application power consumption budget is ...