Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

Every Wednesday and Friday, TechNode’s Briefing newsletter delivers a roundup of the most important news in China tech, straight to your inbox. Sign up Traditionally, packaging has been considered a ...

The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...

Contrel Technology, an LCD equipment specialist, is increasing its deployment in MicroLED and advanced packaging, which is expected to yield results in 2025. Save my User ID and Password Some ...

LED equipment manufacturer FitTech is gearing up to begin contract production of CoWoS advanced packaging equipment in the fourth quarter of 2024. Save my User ID and Password Some subscribers prefer ...

Onto Innovation's Specialty Devices & Advanced Packaging segment drives growth, increasing its revenue share from 40% in 2020 to 67% in 2024, with a 34% annual growth rate. Strong demand from the ...

Advanced packaging mechanisms play a vital role in reducing food waste and ensuring the maintenance of quality during storage. An incredible challenge faced by the food industry is the development of ...

KAOHSIUNG, May 12, 2025 /PRNewswire/ -- E&R Engineering Corp. is excited to participate in the 75th IEEE Electronic Components and Technology Conference (ECTC), taking place from May 27–30, 2025 at ...